? semiconductor components industries, llc, 2004 may, 2004 ? rev. 4 1 publication order number: MMBT918Lt1/d MMBT918Lt1 vhf/uhf transistor npn silicon features ? pb?free package is available maximum ratings rating symbol value unit collector ?emitter voltage v ceo 15 vdc collector ?base voltage v cbo 30 vdc emitter ?base voltage v ebo 3.0 vdc collector current ? continuous i c 50 madc thermal characteristics characteristic symbol max unit total device dissipation fr? 5 board, (note 1) t a = 25 c derate above 25 c p d 225 1.8 mw mw/ c thermal resistance, junction to ambient r ja 556 c/w total device dissipation alumina substrate, (note 2) t a = 25 c derate above 25 c p d 300 2.4 mw mw/ c thermal resistance, junction?to?ambient r ja 417 c/w junction and storage temperature t j , t stg ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. fr?5 = 1.0 x 0.75 x 0.062 in. 2. alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina. http://onsemi.com device package shipping 2 ordering information MMBT918Lt1 sot?23 3000 / tape & reel MMBT918Lt1g sot?23 (pb?free) sot?23 (to?236af) case 318 style 6 3000 / tape & reel marking diagram m3b m3b = specific device code 1 2 3 collector 3 1 base 2 emitter 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d.
MMBT918Lt1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics collector ?emitter breakdown voltage (i c = 3.0 madc, i b = 0) v (br)ceo 15 ? vdc collector ?base breakdown voltage (i c = 1.0 adc, i e = 0) v (br)cbo 30 ? vdc emitter ?base breakdown voltage (i e = 10 adc, i c = 0) v (br)ebo 3.0 ? vdc collector cutoff current (v cb = 15 vdc, i e = 0) i cbo ? 50 nadc on characteristics dc current gain (i c = 3.0 madc, v ce = 1.0 vdc) h fe 20 ? ? collector ?emitter saturation voltage (i c = 10 madc, i b = 1.0 madc) v ce(sat) ? 0.4 vdc base ?emitter saturation voltage (i c = 10 madc, i b = 1.0 madc) v be(sat) ? 1.0 vdc small?signal characteristics current ?gain ? bandwidth product (i c = 4.0 madc, v ce = 10 vdc, f = 100 mhz) f t 600 ? mhz output capacitance (v cb = 0 vdc, i e = 0, f = 1.0 mhz) (v cb = 10 vdc, i e = 0, f = 1.0 mhz) c obo ? ? 3.0 1.7 pf input capacitance (v eb = 0.5 vdc, i c = 0, f = 1.0 mhz) c ibo ? 2.0 pf noise figure (i c = 1.0 madc, v ce = 6.0 vdc, r s = 50 , f = 60 mhz) (figure 1) nf ? 6.0 db power output (i c = 8.0 madc, v cb = 15 vdc, f = 500 mhz) p out 30 ? mw common?emitter amplifier power gain (i c = 6.0 madc, v cb = 12 vdc, f = 200 mhz) g pe 11 ? db
MMBT918Lt1 http://onsemi.com 3 figure 1. nf, g p e measurement circuit 20?200 v bb v cc external 100 k 0.018 f 0.018 f 3 1000 pf bypass 0.018 f 0.018 f 50 rf vm nf test conditions i c = 1.0 ma v ce = 6.0 volts r s = 50 f = 60 mhz g pe test conditions i c = 6.0 ma v ce = 12 volts f = 200 mhz c g
MMBT918Lt1 http://onsemi.com 4 package dimensions d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0140 0.0285 0.35 0.69 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.1039 2.10 2.64 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318-03 and -07 obsolete, new standard 318-08. style 6: pin 1. base 2. emitter 3. collector sot?23 (to?236) case 318?08 issue ah *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 MMBT918Lt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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